TSMC unveiled its latest technology, A16 (1.6nm), at the 2024 North America Technology Symposium in California. The Taiwan-based chip foundry announced plans to mass produce the new manufacturing process by 2026. During the symposium, TSMC highlighted that A16 would improve logic density and chip performance by integrating advanced nanosheet transistors with backside power rail solutions. In comparison to N2P, A16 offers significant benefits such as an 8-10% increase in speed, a 15-20% reduction in power consumption, and a density enhancement of up to 1.1 times to cater to data center products.
TSMC Unveils Next-Generation A16 Chip Process with Improved Speed, Efficiency and Density: Mass Production Planned for 2026
