Micron’s 232-layer QLC NAND flash memory now in mass production, providing improved performance for various storage use cases and a better user experience in PCs.

Micron Technology to Begin Mass Production of 200+ Layer QLC NAND

Micron Technology Inc. has announced that its 232-layer QLC NAND flash memory is now in mass production. The memory is being shipped to enterprise storage customers and sampled to original equipment PC manufacturers. This 232-layer QLC NAND provides improved performance for various storage use cases, including mobile, client, edge, and data center storage.

Micron has stated that it is more compact, enabling thin and light devices, and has a higher bit-density with NAND I/O speeds of 2400 MT/s, a 50% improvement over the prior generation. Additionally, it offers better read and programming performance over the earlier generation.

To further enhance everyday computing and improve the PC user experience, Micron has integrated the 232-layer QLC NAND into its new 2500 Client SSD. The SSD has shown superior PCMark 10 experience benchmark results, outperforming the average scores in the SSD segment. Micron anticipates that as the industry shifts to QLC-based storage, the 2500 SSD will further accelerate QLC adoption in PCs due to its world-class user experience and value proposition.

The 2500 SSD boasts up to 7.1 GB/s sequential read speeds, superior to TLC-based NAND and QLC-based NAND SSDs in the segment. The accelerated caching feature enables faster read and write performance under various applications. The 232-layer QLC NAND enables even the smaller capacity 512GB SSD to provide endurance to support 13 4K movie downloads per day, every day for three years.

Available in form factors ranging from

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