Samsung is exploring new heatsink technology to address overheating issues in future Exynos chipsets. The company’s Advanced Package (AVP) business within its chip division is leading the development effort and is projected to finalize the technology by Q4 2024, with mass production to follow. This new chip-packaging technology, known as fan-out wafer-level package-HPB (FOWLP-HPB), aims to enhance heat dissipation by implementing a heat path block (HPB) heatsink on top of the processor.
Samsung’s consideration of different processor options for its upcoming Galaxy S25 series flagship has been a subject of speculation. Earlier reports suggested that the series might use the Exynos 2500 processor in certain regions, potentially even outperforming the Snapdragon 8 Gen 4 processor. However, there have been conflicting reports about Samsung’s processor choices, with some suggesting a switch to MediaTek due to yield issues. Industry analysts have also hinted that Qualcomm could become the exclusive chip supplier for the Galaxy S25 lineup, further complicating the predictions.
The potential integration of this new heatsink technology in upcoming Exynos processors aligns with speculation that the Exynos 2500 chipset might power the Galaxy S25 series. However, there are talks of Samsung streamlining its Galaxy S series lineup by discontinuing the Plus models and possibly incorporating three different chips in varying combinations. As consumers and tech enthusiasts eagerly await official announcements regarding Samsung’s future flagship devices, they will need to navigate through these speculations and technological developments while keeping their eyes on what may be ahead for one of the world’s biggest smartphone makers.
