Rapidus, a Japanese semiconductor company, is in the process of developing 2nm process technology with the goal of commercializing it by 2027. The Japanese government has awarded Rapidus a significant grant totaling ¥590 billion yen ($3.89 billion) to support its projects. This funding will be used for various purposes, including developing the 2nm production node, purchasing cleanroom equipment, and funding the development of multi-chiplet packaging technology.
With the added government funding, Rapidus is better positioned to achieve its ambitious goals. The total support from the government now amounts to ¥920 billion ($6.068 billion), providing a strong foundation for the company to establish itself as a key player in the semiconductor industry. While the entire project is estimated to cost around ¥5 trillion ($32.983 billion), Rapidus is optimistic about securing the necessary financing with the support from the Japanese government and major corporations like Toyota Motor and Nippon Telegraph and Telephone.
Rapidus aims to commence testing its production by April 2025, followed by large-scale production in 2027. Commercial production of 2nm chips is expected to begin in 2025. In addition to collaborating with IBM to develop the 2nm fabrication process and constructing its manufacturing facility, Rapidus is focusing on advanced packaging technology for multi-chiplet system-in-packages (SiPs). The latest government subsidies include more than ¥50 billion ($329.85 million) for research and development in this area, marking the first time Japan has provided subsidies for such technologies.
One notable aspect of this project is that Rapidus will utilize a section of Seiko Epson Corporation’s Chitose Plant for its back-end packaging processes
