IBM has announced a new partnership with Rapidus, aimed at developing mass production technologies for chiplet packages. This collaboration is the result of an international project conducted by Japan’s NEDO, which focused on the development of chiplet and package design and manufacturing technology for 2nm-generation semiconductors.
As part of the agreement, IBM will provide Rapidus with packaging technology for high-performance semiconductors, in order to collaborate on further innovations in this field. Rapidus will utilize IBM’s expertise in semiconductor packaging to establish chiplet packaging technology, contributing to advancements in the semiconductor industry.
This partnership builds on an existing agreement between the two companies for joint development of 2nm node technology. Engineers from both companies will work together at IBM’s facilities in North America to research and develop semiconductor packaging for high-performance computer systems. IBM has a strong background in R&D and manufacturing technologies for semiconductor packaging, as well as experience in partnering with Japanese semiconductor manufacturers and equipment/material suppliers.
This strategic collaboration aims to drive innovation and enhance semiconductor manufacturing capabilities for high-performance computer systems.
